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Bonding Film for electronics assembly

Characteristics
·High adhesion to both metal and plastic substrates
·Flexibility to withstand shock
·Flows and compensates for substrate-to substrate tolerance gaps
·Bonds narrow widths

Properties

Item
Density(g/cm3)
Tensile strength(MPa)
MeltingPoint(℃)
Bonding time(s)
Bonding temperature(℃)
Peeling strength(N/cm)
EH1515
0.93
10
75
15
150
12
EH1725
0.93
14
98
15
150
10
EH615
1.05
14
89
10
138
12

 

 
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